WS-3800
The fastest and most comprehensive 300mm wafer inspection system in the business.
Advanced defect detection. Plus the flexibility to handle 3-D metrology with the highest accuracy. No wonder the WS-3800 is the industry choice for any application. 
   No matter what your requirements are—identifying micro defects or 3D bump metrology—and no matter how frequently those requirements change, the WS-3800 is up to the task. All while delivering the best overall cost of ownership, by maximzing yield and tool availability and maintaining an unmatched combination of speed and accuracy.
Key benefits of the WS-3800:
• Superior wafer defect detection at production speeds
• Comprehensive probe mark detection
• Complete bump defect detection (for flip chip applications)
• Crater, nodule and killer defect inspection for gold bumps
• The fastest, most accurate 3D bump metrology
• State-of-the-art camera lighting and processing
• Scalable for the application
• Robust XY stage design is future-compatible
• AutoTeach module makes it easy to handle new wafer types
• Advanced machine-to-machine correlation
• Adheres to all 300mm SECS/GEM standards
• Best overall cost of ownership