WS-2800
Advanced defect detection for
post-fab process management.
For both standard and flip chip wafers up to 200mm in diameter, the WS-2800 Wafer Inspection System provides superior yield management for defect inspection throughout post-fab processes. Defects created in the post-fab area between wafer processing and final manufacturing can negatively impact production yields and time-to-market. The WS-2800 quickly and reliably locates wafer defects and classifies them—reducing process costs and improving yield.
Key benefits of the WS-2800:
• High-speed surface defect inspection
• 100% inspection ensures no escapes
• Integrated inspection tool for fast response to process variations
• Inspection step is a valuable addition to the entire wafer
  manufacturing process